IP网络实施QoS的策略分析

介绍了衡量IP QoS的技术指标和业务等级的划分，提出了IP网络中QoS的实施建议。     

利用中石油域用户认证系统实现数据存储备份

系统面向中石油域用户提供了安全、高速的数据传输服务.实现了数据传输DES加密、用户登录LDAP限制、系统安全审计、空间容量扩容等功能.充分利用SAN网络光存储设备,同时也为油田网络存储应用的开发提供了成功经验.     

Low temperature wafer direct bonding

A pronounced increase of interface energy of room temperature bonded hydrophilic Si/Si, Si/SiO₂, and SiO₂/SiO ₂ wafers after storage in air at room temperature, 150°C for 10-400 h has been observed. The increased number of OH groups due to a reaction between water and the strained oxide and/or silicon at the interface at temperatures below 110°C and the formation of stronger siloxane bonds above 110°C appear to be the main mechanisms responsible for the increase in the interface energy. After prolonged storage, interface bubbles are detectable by an infrared camera at the Si/Si bonding seam. Desorbed hydrocarbons as well as hydrogen generated by a reaction of water with silicon appear to be the major contents in the bubbles. Design guidelines for low temperature wafer direct bonding technology are proposed     

聚氧乙烯油酸酯的合成与物性

论述了合成聚氧乙烯油酸酯的较佳反应条件,探讨了不同EO加成数的聚氧乙烯油酸脂的表面物性规律。     

Effect of Tongmai Decoction on expression of NF-κB in ox-LDL injured endothelial cells

Objective Study on the effect of NF-κB in ox-LDL injured HUVEC-304 and the intervention with the serum of Tongmai Decoction. Methods Tongmai Decoction herbage-contained serum was made by the serum pharmacology methods, then the HUVEC-304 cells were divided into 5 groups and incubated for 24 h: 1) normal group;2) fetal calf serum group; 3) ox-LDL group; 4) simvastatin group; 5) Tongmai Decoction group. RT-PCR was used to determine the mRNA of NF-κB in the cells, Western Blot Assay was used to determine the protein content of NF-κB in the cells. Results 1) Compared with the cells in normal group and serum control group , the endothelial cells in ox-LDL group are seriously injured, while those in Tongmai Decoction group grow better; 2) Compared with the cells in normal group and fetal calf serum group, the expressions of NF-κB gene and protein are up-regulated in ox-LDL group(P＜0.05, P＜0.01); 3) Compared with the cells in ox-LDL group, the expression of NF-κB gene and protein in Tongmai Decoction group are significantly down-regulated, there is no difference between Tongmai Decoction group and simvastatin group(P＞0.05). Conclusion Tongmai Decoction can protect the injured endothelial cells, up-regulate the expressions of NF-κB gene and protein content.     

Cholesterol‐imprinted polymer receptor prepared by a hybrid imprinting method

A novel cholesterol‐imprinted polymer (CMIP‐H) was prepared by a hybrid method of covalent imprinting and non‐covalent imprinting. This approach involves the copolymerization of a template‐containing monomer, cholesteryl 2‐hydroxyethyl methacrylate carbonate, and a cross‐linker, followed by hydrolysis to afford a flexible guest‐binding site accompanied with the easy and efficient removal of a ‘sacrificial spacer’. The effect of solvent on the binding capacity of CMIP‐H towards cholesterol was studied, indicating that a good binding capacity towards cholesterol could be achieved in a less‐polar solvent. The binding experiments of CMIP‐H towards a series of structural analogues of cholesterol, including cholesterol acetate, progesterone and stigmasterol, were carried out in hexane. The results showed that CMIP‐H almost did not bind cholesterol acetate at all because the hydrogen‐bonding site is blocked. It exhibited a similar binding towards both cholesterol and stigmasterol, but much higher binding towards progesterone. Copyright © 2005 Society of Chemical Industry     

Adhesive element modelling and weighted static shape control of composite plates with piezoelectric actuator patches

A novel finite element model is presented for static and dynamic analysis of composite plates integrated with a laminated piezoelectric layer, a host laminated composite plate and an adhesive layer between them. A new adhesive element is developed which includes both peel and shear effects in the adhesive layer based on first‐order shear deformation plate theory. The thin adhesive layer between the piezoelectric layer and the host plate is modelled by assuming that it carries constant shear and peel strains throughout its thickness. In addition, a weighted static shape control scheme for finding the optimal voltage distribution for static shape control is given. By selecting different weighting matrices, a variety of items such as displacements, slopes, curvatures, strains and even generalized forces, can be included in finding the optimal actuating voltage for static shape control. The present model is validated by comparing with those results available in the literature. The numerical results show that the weighted linear least method can give a satisfactory voltage distribution to best match the desired shape. Copyright © 2004 John Wiley & Sons, Ltd.     

Two-dimensional symmetric multimode interferences in silicon square waveguides

Symmetric interference in two-dimensional multimode silicon waveguides is experimentally investigated. For a 100/spl times/100 /spl mu/m/sup 2/ cross section, 2700-/spl mu/m-long waveguide fabricated on silicon-on-insulator substrate, an 8/spl times/8 matrix of replicated images with high contrast ratio is demonstrated for 1530-1570 nm wavelength range. Symmetric interference results in reduced device length, and the actual device length is consistent with the theoretical expectation. The device also exhibits stable imaging in terms of good loss uniformity, and low wavelength and polarization dependencies among the replicated images.     

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

In this paper we verified the submodeling technique applied in the thermomechanical reliability assessment of a flip-chip BGA under accelerated thermal cycling test conditions. Since the steady-state creep model was implemented for the solder bump to better represent its realistic mechanical behavior, submodeling procedures developed specifically for path-dependent thermomechanical problems were considered. A detailed global model for the flip-chip BGA was built up to verify submodeling solutions. This model also served as a benchmark to examine solution discrepancies caused by different simplifications of the global model.